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| 32.0-42.0 GHz GaAs MMIC Image Reject Mixer February 2007 - Rev 16-Feb-07 M1003-BD Chip Device Layout Features Sub-harmonic Image Reject Mixer GaAs HBT Technology 9.0 dB Conversion Loss 18.0 dB Image Rejection 100% On-Wafer RF Testing 100% Visual Inspection to MIL-STD-883 Method 2010 XM1003-BD General Description Mimix Broadband's 32.0-42.0 GHz GaAs MMIC sub-harmonic image reject mixer can be used as an upor down-converter. The device has a conversion loss of 9.0 dB with 18.0 dB image rejection across the band. I and Q mixer outputs are provided and an external 90 degree hybrid is required to select the desired sideband. This MMIC uses Mimix Broadband's 2 m GaAs HBT device model technology, and is based upon electron beam lithography to ensure high repeatability and uniformity. The chip has surface passivation to protect and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VSAT applications. Parameter Frequency Range (RF) Upper Side Band Frequency Range (RF) Lower Side Band Frequency Range (LO) Frequency Range (IF) RF Return Loss (S11) IF1/IF2 Return Loss (S22) LO Return Loss (S33) Conversion Loss (S21) LO Input Drive (PLO) Image Rejection Isolation LO/RF Isolation LO/IF Isolation RF/IF Input Third Order Intercept (IIP3) Absolute Maximum Ratings Input Power (RF Pin) Input Power (IF Pin) Storage Temperature (Tstg) Operating Temperature (Ta) +20 dBm +20 dBm -65 to +165 OC -55 to +125 OC Electrical Characteristics (Ambient Temperature T = 25o C) Units GHz GHz GHz GHz dB dB dB dB dBm dBc dBc dB dB dBm Min. 34.0 32.0 15.0 DC Typ. 10.0 TBD TBD 9.0 +12.0 18.0 -40.0 TBD TBD +14.0 Max. 42.0 42.0 23.0 4.0 Page 1 of 7 Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com Characteristic Data and Specifications are subject to change without notice. (c)2007 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws. 32.0-42.0 GHz GaAs MMIC Image Reject Mixer February 2007 - Rev 16-Feb-07 M1003-BD Mixer Measurements Down Conversion XM1003-BD (USB, down conversion, IF=2GHz, PRF=-20dBm, PLO=+12,15 & 18dBm): USB Conversion Loss (dB) vs. RF freq (GHz) LO freq (GHz) 12 0 -5 -10 USB Conversion Loss (dB) -15 Conv Loss, LO Power (dBm)=12, DeviceCoord=R11C5 Conv Loss, LO Power (dBm)=12, DeviceCoord=R12C6 XM1003-BD (LSB, down conversion, IF=2GHz, PRF=-20dBm, PLO=+12,15 & 18dBm): LSB Conversion Loss (dB) vs. RF freq (GHz) LO freq (GHz) 14 16 18 20 22 24 14 0 -5 -10 LSB Conversion Loss (dB) -15 16 18 20 22 24 26 Conv Loss, LO Power (dBm)=12, DeviceCoord=R11C5 -20 -25 -30 -35 -40 -45 -50 26 30 34 38 RF freq (GHz) 42 46 50 Conv Loss, LO Power (dBm)=12, DeviceCoord=R9C5 Conv Loss, LO Power (dBm)=12, DeviceCoord=R9C7 Conv Loss, LO Power (dBm)=15, DeviceCoord=R11C5 Conv Loss, LO Power (dBm)=15, DeviceCoord=R12C6 Conv Loss, LO Power (dBm)=15, DeviceCoord=R9C5 Conv Loss, LO Power (dBm)=15, DeviceCoord=R9C7 Conv Loss, LO Power (dBm)=18, DeviceCoord=R11C5 Conv Loss, LO Power (dBm)=18, DeviceCoord=R12C6 Conv Loss, LO Power (dBm)=18, DeviceCoord=R9C5 Conv Loss, LO Power (dBm)=18, DeviceCoord=R9C7 -20 -25 -30 -35 -40 -45 -50 26 30 34 38 RF freq (GHz) 42 46 50 Conv Loss, LO Power (dBm)=12, DeviceCoord=R12C6 Conv Loss, LO Power (dBm)=12, DeviceCoord=R9C5 Conv Loss, LO Power (dBm)=12, DeviceCoord=R9C7 Conv Loss, LO Power (dBm)=15, DeviceCoord=R11C5 Conv Loss, LO Power (dBm)=15, DeviceCoord=R12C6 Conv Loss, LO Power (dBm)=15, DeviceCoord=R9C5 Conv Loss, LO Power (dBm)=15, DeviceCoord=R9C7 Conv Loss, LO Power (dBm)=18, DeviceCoord=R11C5 Conv Loss, LO Power (dBm)=18, DeviceCoord=R12C6 Conv Loss, LO Power (dBm)=18, DeviceCoord=R9C5 Conv Loss, LO Power (dBm)=18, DeviceCoord=R9C7 XM1003-BD (USB, down conversion, IF=2GHz, PRF=-20dBm, PLO=+12,15 & 18dBm): Image Rejection (dBc) vs. RF freq (GHz) LO freq (GHz) 12 5 0 -5 -10 Image Rejection (dBc) 14 16 18 20 22 24 XM1003-BD(LSB, down conversion, IF=2GHz, PRF=-20dBm, PLO=+12,15 & 18dBm): Image Rejection (dBc) vs. RF freq (GHz) LO freq (GHz) 14 0 -5 -10 -15 Image Rejection (dBc) 16 18 20 22 24 26 Im Rej, LO Power (dBm)=12, DeviceCoord=R11C5 Conv Loss, LO Power (dBm)=12, DeviceCoord=R11C5 Conv Loss, LO Power (dBm)=12, DeviceCoord=R12C6 -15 -20 -25 -30 -35 -40 -45 -50 26 30 34 38 RF freq (GHz) 42 46 50 Im Rej, LO Power (dBm)=12, DeviceCoord=R12C6 Im Rej, LO Power (dBm)=12, DeviceCoord=R9C5 Im Rej, LO Power (dBm)=12, DeviceCoord=R9C7 Im Rej, LO Power (dBm)=15, DeviceCoord=R11C5 Im Rej, LO Power (dBm)=15, DeviceCoord=R12C6 Im Rej, LO Power (dBm)=15, DeviceCoord=R9C5 Im Rej, LO Power (dBm)=15, DeviceCoord=R9C7 Im Rej, LO Power (dBm)=18, DeviceCoord=R11C5 Im Rej, LO Power (dBm)=18, DeviceCoord=R12C6 Im Rej, LO Power (dBm)=18, DeviceCoord=R9C5 Im Rej, LO Power (dBm)=18, DeviceCoord=R9C7 -20 -25 -30 -35 -40 -45 -50 26 30 34 38 RF freq (GHz) 42 46 50 Conv Loss, LO Power (dBm)=12, DeviceCoord=R9C5 Conv Loss, LO Power (dBm)=12, DeviceCoord=R9C7 Conv Loss, LO Power (dBm)=15, DeviceCoord=R11C5 Conv Loss, LO Power (dBm)=15, DeviceCoord=R12C6 Conv Loss, LO Power (dBm)=15, DeviceCoord=R9C5 Conv Loss, LO Power (dBm)=15, DeviceCoord=R9C7 Conv Loss, LO Power (dBm)=18, DeviceCoord=R11C5 Conv Loss, LO Power (dBm)=18, DeviceCoord=R12C6 Conv Loss, LO Power (dBm)=18, DeviceCoord=R9C5 Conv Loss, LO Power (dBm)=18, DeviceCoord=R9C7 XM1003-BD (USB, Down Conversion, IF=2GHz, IF1-IF2=100MHz, PRF=-15dBm, LO=12, 15 & 18 dBm): OIP3 avg (dBm) vs. LO freq (GHz), IIP3 avg (dBm) vs. RF freq (GHz) RF freq (GHz) 29 20 30 31 32 33 34 35 36 37 38 39 40 41 XM1003-BD (LSB, Down Conversion, IF=2GHz, IF1-IF2=100MHz, PRF=-15dBm, LO=12, 15 & 18 dBm): OIP3 avg (dBm) vs. LO freq (GHz), IIP3 avg (dBm) vs. RF freq (GHz) RF freq (GHz) 29 25 20 31 33 35 37 39 41 15 OIP3 avg (dBm), LO Power (dBm)=12, DeviceCoord=R12C6 OIP3 avg (dBm) / IIP3 avg (dBm) OIP3 avg (dBm) / IIP3 avg (dBm) 10 OIP3 avg (dBm), LO Power (dBm)=12, DeviceCoord=R9C5 OIP3 avg (dBm), LO Power (dBm)=12, DeviceCoord=R9C7 OIP3 avg (dBm), LO Power (dBm)=15, DeviceCoord=R12C6 OIP3 avg (dBm), LO Power (dBm)=15, DeviceCoord=R9C5 15 10 5 0 -5 -10 -15 -20 15.5 OIP3 avg (dBm), LO Power (dBm)=12, DeviceCoord=R12C6 OIP3 avg (dBm), LO Power (dBm)=12, DeviceCoord=R9C5 OIP3 avg (dBm), LO Power (dBm)=12, DeviceCoord=R9C7 OIP3 avg (dBm), LO Power (dBm)=15, DeviceCoord=R12C6 OIP3 avg (dBm), LO Power (dBm)=15, DeviceCoord=R9C5 OIP3 avg (dBm), LO Power (dBm)=15, DeviceCoord=R9C7 OIP3 avg (dBm), LO Power (dBm)=18, DeviceCoord=R12C6 OIP3 avg (dBm), LO Power (dBm)=18, DeviceCoord=R9C5 OIP3 avg (dBm), LO Power (dBm)=18, DeviceCoord=R9C7 IIP3 avg (dBm), LO Power (dBm)=12, DeviceCoord=R12C6 IIP3 avg (dBm), LO Power (dBm)=12, DeviceCoord=R9C5 IIP3 avg (dBm), LO Power (dBm)=12, DeviceCoord=R9C7 IIP3 avg (dBm), LO Power (dBm)=15, DeviceCoord=R12C6 IIP3 avg (dBm), LO Power (dBm)=15, DeviceCoord=R9C5 IIP3 avg (dBm), LO Power (dBm)=15, DeviceCoord=R9C7 IIP3 avg (dBm), LO Power (dBm)=18, DeviceCoord=R12C6 IIP3 avg (dBm), LO Power (dBm)=18, DeviceCoord=R9C5 5 OIP3 avg (dBm), LO Power (dBm)=15, DeviceCoord=R9C7 OIP3 avg (dBm), LO Power (dBm)=18, DeviceCoord=R12C6 OIP3 avg (dBm), LO Power (dBm)=18, DeviceCoord=R9C5 0 OIP3 avg (dBm), LO Power (dBm)=18, DeviceCoord=R9C7 IIP3 avg (dBm), LO Power (dBm)=12, DeviceCoord=R12C6 IIP3 avg (dBm), LO Power (dBm)=12, DeviceCoord=R9C5 IIP3 avg (dBm), LO Power (dBm)=12, DeviceCoord=R9C7 -5 IIP3 avg (dBm), LO Power (dBm)=15, DeviceCoord=R12C6 IIP3 avg (dBm), LO Power (dBm)=15, DeviceCoord=R9C5 IIP3 avg (dBm), LO Power (dBm)=15, DeviceCoord=R9C7 IIP3 avg (dBm), LO Power (dBm)=18, DeviceCoord=R12C6 -10 IIP3 avg (dBm), LO Power (dBm)=18, DeviceCoord=R9C5 IIP3 avg (dBm), LO Power (dBm)=18, DeviceCoord=R9C7 -15 IIP3 avg (dBm), LO Power (dBm)=18, DeviceCoord=R9C7 -20 13.5 14 14.5 15 15.5 16 16.5 17 17.5 18 18.5 19 19.5 16 16.5 17 17.5 18 18.5 19 19.5 20 20.5 21 21.5 LO freq (GHz) LO freq (GHz) Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com Page 2 of 7 Characteristic Data and Specifications are subject to change without notice. (c)2007 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws. 32.0-42.0 GHz GaAs MMIC Image Reject Mixer February 2007 - Rev 16-Feb-07 M1003-BD Mixer Measurements Up Conversion XM1003-BD (Up conversion, PIF=-15dBm, IF=2GHz, USB, PLO=+9dBm): USB Conversion gain (dB) & Image Rejection (dBc) vs. RF freq (GHz) & LO freq (GHz) LO freq (GHz) 15.5 0 16 16.5 17 17.5 18 18.5 19 XM1003-BD (Up conversion, PIF=-15dBm, IF=2GHz, LSB, PLO=+9dBm): USB Conversion gain (dB) & Image Rejection (dBc) vs. RF freq (GHz) & LO freq (GHz) LO freq (GHz) 16 0 16.5 17 17.5 18 18.5 19 19.5 20 20.5 21 USB Conversion gain (dB) / Image Rejection (dBc) -5 LSB Conversion gain (dB) / Image Rejection (dBc) -5 -10 -10 -15 -15 -20 -20 -25 -25 -30 -30 -35 -35 -40 33 34 35 36 37 38 39 40 RF freq (GHz) -40 30 31 32 33 34 35 RF freq (GHz) 36 37 38 39 40 XM1003-BD (Up conversion, PIF=-15dBm, IF=2GHz, USB, PLO=+12dBm): USB Conversion gain (dB) & Image Rejection (dBc) vs. RF freq (GHz) & LO freq (GHz) LO freq (GHz) 15.5 0 16 16.5 17 17.5 18 18.5 19 XM1003-BD (Up conversion, PIF=-15dBm, IF=2GHz, LSB, PLO=+12dBm): USB Conversion gain (dB) & Image Rejection (dBc) vs. RF freq (GHz) & LO freq (GHz) LO freq (GHz) 16 0 16.5 17 17.5 18 18.5 19 19.5 20 20.5 21 USB Conversion gain (dB) / Image Rejection (dBc) LSB Conversion gain (dB) / Image Rejection (dBc) -5 -5 -10 -10 -15 -15 -20 -20 -25 -25 -30 -30 -35 -35 -40 33 34 35 36 37 38 39 40 RF freq (GHz) -40 30 31 32 33 34 35 RF freq (GHz) 36 37 38 39 40 XM1003-BD (Up conversion, PIF=-15dBm, IF=2GHz, USB, PLO=+15dBm): USB Conversion gain (dB) & Image Rejection (dBc) vs. RF freq (GHz) & LO freq (GHz) LO freq (GHz) 15.5 0 16 16.5 17 17.5 18 18.5 19 USB Conversion gain (dB) / Image Rejection (dBc) -5 -10 -15 -20 -25 -30 -35 -40 33 34 35 36 37 38 39 40 RF freq (GHz) Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com Page 3 of 7 Characteristic Data and Specifications are subject to change without notice. (c)2007 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws. 32.0-42.0 GHz GaAs MMIC Image Reject Mixer February 2007 - Rev 16-Feb-07 M1003-BD Mixer Measurements Up Conversion (cont.) XM1003-BD (Up conversion, PIF=-15dBm, IF=2GHz, USB, PLO=+9,+12 and +15dBm): LOxharm to RF gain (dB) vs. RF freq (GHz) 0 -5 -10 -15 XM1003-BD (LSB,Up conversion, PIF=-15dBm, IF=2GHz, LSB, PLO=+9,+12 and 15dBm): LOxharm to RF gain (dB) vs. LO freq (GHz) 0 -5 -10 -15 -20 LOxharm to RF gain (dB) -25 -30 -35 -40 -45 -50 -55 -60 -65 -70 -20 LOxharm to RF gain (dB) -25 -30 -35 -40 -45 -50 -55 -60 -65 -70 30 31 32 33 34 35 RF freq (GHz) 36 37 38 39 40 16 17 18 LO freq (GHz) 19 20 21 OIP3 avg (dBm), LO Power (dBm)=12, Device=R10C7 XM1003-BD (Up Conv, IF=2GHz, IF1-IF2=0.1GHz, USB, Pout=-23dBm): OIP3 avg (dBm) vs. LO freq (GHz) & IIP3 (dBm) vs RF freq (GHz) RF freq (GHz) 32 15 34 36 38 40 42 44 46 10 OIP3 avg (dBm) / IIP3 (dBm) 5 0 -5 -10 15 16 17 18 19 20 21 22 LO Freq (GHz) OIP3 avg (dBm), LO Power (dBm)=12, Device=R10C7 OIP3 avg (dBm), LO Power (dBm)=12, Device=R11C7 OIP3 avg (dBm), LO Power (dBm)=12, Device=R12C5 OIP3 avg (dBm), LO Power (dBm)=12, Device=R12C8 OIP3 avg (dBm), LO Power (dBm)=12, Device=R12C8_2 OIP3 avg (dBm), LO Power (dBm)=12, Device=R14C6 OIP3 avg (dBm), LO Power (dBm)=13, Device=R10C7 OIP3 avg (dBm), LO Power (dBm)=13, Device=R11C7 OIP3 avg (dBm), LO Power (dBm)=13, Device=R12C5 OIP3 avg (dBm), LO Power (dBm)=13, Device=R12C8 OIP3 avg (dBm), LO Power (dBm)=13, Device=R12C8_2 OIP3 avg (dBm), LO Power (dBm)=13, Device=R14C6 OIP3 avg (dBm), LO Power (dBm)=14, Device=R10C7 OIP3 avg (dBm), LO Power (dBm)=14, Device=R11C7 OIP3 avg (dBm), LO Power (dBm)=14, Device=R12C5 OIP3 avg (dBm), LO Power (dBm)=14, Device=R12C8 OIP3 avg (dBm), LO Power (dBm)=14, Device=R12C8_2 OIP3 avg (dBm), LO Power (dBm)=14, Device=R14C6 OIP3 avg (dBm), LO Power (dBm)=15, Device=R10C7 OIP3 avg (dBm), LO Power (dBm)=15, Device=R11C7 OIP3 avg (dBm), LO Power (dBm)=15, Device=R12C5 OIP3 avg (dBm), LO Power (dBm)=15, Device=R12C8 OIP3 avg (dBm), LO Power (dBm)=15, Device=R12C8_2 OIP3 avg (dBm), LO Power (dBm)=15, Device=R14C6 IIP3 (dBm), LO Power (dBm)=12, Device=R10C7 IIP3 (dBm), LO Power (dBm)=12, Device=R11C7 IIP3 (dBm), LO Power (dBm)=12, Device=R12C5 IIP3 (dBm), LO Power (dBm)=12, Device=R12C8 IIP3 (dBm), LO Power (dBm)=12, Device=R12C8_2 IIP3 (dBm), LO Power (dBm)=12, Device=R14C6 IIP3 (dBm), LO Power (dBm)=13, Device=R10C7 IIP3 (dBm), LO Power (dBm)=13, Device=R11C7 IIP3 (dBm), LO Power (dBm)=13, Device=R12C5 IIP3 (dBm), LO Power (dBm)=13, Device=R12C8 IIP3 (dBm), LO Power (dBm)=13, Device=R12C8_2 IIP3 (dBm), LO Power (dBm)=13, Device=R14C6 IIP3 (dBm), LO Power (dBm)=14, Device=R10C7 IIP3 (dBm), LO Power (dBm)=14, Device=R11C7 IIP3 (dBm), LO Power (dBm)=14, Device=R12C5 IIP3 (dBm), LO Power (dBm)=14, Device=R12C8 IIP3 (dBm), LO Power (dBm)=14, Device=R12C8_2 IIP3 (dBm), LO Power (dBm)=14, Device=R14C6 IIP3 (dBm), LO Power (dBm)=15, Device=R10C7 IIP3 (dBm), LO Power (dBm)=15, Device=R11C7 IIP3 (dBm), LO Power (dBm)=15, Device=R12C5 IIP3 (dBm), LO Power (dBm)=15, Device=R12C8 IIP3 (dBm), LO Power (dBm)=15, Device=R12C8_2 IIP3 (dBm), LO Power (dBm)=15, Device=R14C6 XM1003-BD (Up Conv, IF=2GHz, IF1-IF2=0.1GHz, LSB, Pout=-23dBm): OIP3 avg (dBm) vs. LO freq (GHz) & IIP3 avg (dBm) vs RF freq RF freq (GHz) 32 15 34 36 38 40 42 44 46 OIP3 avg (dBm), LO Power (dBm)=12, Device=R11C7 OIP3 avg (dBm), LO Power (dBm)=12, Device=R12C5 OIP3 avg (dBm), LO Power (dBm)=12, Device=R12C8 OIP3 avg (dBm), LO Power (dBm)=12, Device=R12C8_2 OIP3 avg (dBm), LO Power (dBm)=12, Device=R14C6 OIP3 avg (dBm), LO Power (dBm)=13, Device=R10C7 OIP3 avg (dBm), LO Power (dBm)=13, Device=R11C7 OIP3 avg (dBm), LO Power (dBm)=13, Device=R12C5 OIP3 avg (dBm), LO Power (dBm)=13, Device=R12C8 OIP3 avg (dBm), LO Power (dBm)=13, Device=R12C8_2 OIP3 avg (dBm), LO Power (dBm)=13, Device=R14C6 OIP3 avg (dBm), LO Power (dBm)=14, Device=R10C7 OIP3 avg (dBm), LO Power (dBm)=14, Device=R11C7 OIP3 avg (dBm), LO Power (dBm)=14, Device=R12C5 OIP3 avg (dBm), LO Power (dBm)=14, Device=R12C8 OIP3 avg (dBm), LO Power (dBm)=14, Device=R12C8_2 OIP3 avg (dBm), LO Power (dBm)=14, Device=R14C6 OIP3 avg (dBm), LO Power (dBm)=15, Device=R10C7 OIP3 avg (dBm), LO Power (dBm)=15, Device=R11C7 OIP3 avg (dBm), LO Power (dBm)=15, Device=R12C5 OIP3 avg (dBm), LO Power (dBm)=15, Device=R12C8_2 OIP3 avg (dBm), LO Power (dBm)=15, Device=R14C6 10 OIP3 avg (dBm) / IIP3 (dBm) 5 OIP3 avg (dBm), LO Power (dBm)=15, Device=R12C8 IIP3 (dBm) , LO Power (dBm)=12, Device=R10C7 IIP3 (dBm) , LO Power (dBm)=12, Device=R11C7 IIP3 (dBm) , LO Power (dBm)=12, Device=R12C5 IIP3 (dBm) , LO Power (dBm)=12, Device=R12C8 IIP3 (dBm) , LO Power (dBm)=12, Device=R12C8_2 IIP3 (dBm) , LO Power (dBm)=12, Device=R14C6 IIP3 (dBm) , LO Power (dBm)=13, Device=R10C7 IIP3 (dBm) , LO Power (dBm)=13, Device=R11C7 IIP3 (dBm) , LO Power (dBm)=13, Device=R12C5 IIP3 (dBm) , LO Power (dBm)=13, Device=R12C8 IIP3 (dBm) , LO Power (dBm)=13, Device=R12C8_2 IIP3 (dBm) , LO Power (dBm)=13, Device=R14C6 0 -5 IIP3 (dBm) , LO Power (dBm)=14, Device=R10C7 IIP3 (dBm) , LO Power (dBm)=14, Device=R11C7 IIP3 (dBm) , LO Power (dBm)=14, Device=R12C5 IIP3 (dBm) , LO Power (dBm)=14, Device=R12C8 IIP3 (dBm) , LO Power (dBm)=14, Device=R12C8_2 IIP3 (dBm) , LO Power (dBm)=14, Device=R14C6 IIP3 (dBm) , LO Power (dBm)=15, Device=R10C7 IIP3 (dBm) , LO Power (dBm)=15, Device=R11C7 -10 17 18 19 20 21 22 23 24 LO Freq (GHz) IIP3 (dBm) , LO Power (dBm)=15, Device=R12C5 IIP3 (dBm) , LO Power (dBm)=15, Device=R12C8 IIP3 (dBm) , LO Power (dBm)=15, Device=R12C8_2 IIP3 (dBm) , LO Power (dBm)=15, Device=R14C6 XM1003-BD (Up Conv, IF=2GHz, IF1-IF2=0.1GHz, USB, Pout=-23dBm): im3 avg (dBm) vs. LO freq (GHz) & RF level (dbm) vs RF Freq (GHz) RF freq (GHz) 32 0 34 36 38 40 42 44 46 im3 avg (dBm), LO Power (dBm)=12, Device=R10C7 im3 avg (dBm), LO Power (dBm)=12, Device=R11C7 im3 avg (dBm), LO Power (dBm)=12, Device=R12C5 im3 avg (dBm), LO Power (dBm)=12, Device=R12C8 XM1003-BD (Up Conv, IF=2GHz, IF1-IF2=0.1GHz, LSB, Pout=-23dBm): im3 avg (dBm) vs. LO freq (GHz) & RF level (dbm) vs RF Freq (GHz) RF freq (GHz) 32 0 34 36 38 40 42 44 46 im3 avg (dBm), LO Power (dBm)=12, Device=R10C7 im3 avg (dBm), LO Power (dBm)=12, Device=R11C7 im3 avg (dBm), LO Power (dBm)=12, Device=R12C5 -10 im3 avg (dBm), LO Power (dBm)=12, Device=R12C8_2 im3 avg (dBm), LO Power (dBm)=12, Device=R14C6 im3 avg (dBm), LO Power (dBm)=12, Device=R14C8 -10 im3 avg (dBm), LO Power (dBm)=12, Device=R12C8 im3 avg (dBm), LO Power (dBm)=12, Device=R12C8_2 im3 avg (dBm), LO Power (dBm)=12, Device=R14C6 im3 avg (dBm), LO Power (dBm)=12, Device=R14C8 im3 avg (dBm) / Tone1 Level (dBm) -20 im3 avg (dBm), LO Power (dBm)=13, Device=R10C7 im3 avg (dBm), LO Power (dBm)=13, Device=R11C7 im3 avg (dBm), LO Power (dBm)=13, Device=R12C5 -20 im3 avg (dBm), LO Power (dBm)=13, Device=R10C7 im3 avg (dBm), LO Power (dBm)=13, Device=R11C7 im3 avg (dBm), LO Power (dBm)=13, Device=R12C5 im3 avg (dBm) -30 im3 avg (dBm), LO Power (dBm)=13, Device=R12C8 im3 avg (dBm), LO Power (dBm)=13, Device=R12C8_2 im3 avg (dBm), LO Power (dBm)=13, Device=R14C6 -30 im3 avg (dBm), LO Power (dBm)=13, Device=R12C8 im3 avg (dBm), LO Power (dBm)=13, Device=R12C8_2 im3 avg (dBm), LO Power (dBm)=13, Device=R14C6 -40 im3 avg (dBm), LO Power (dBm)=13, Device=R14C8 im3 avg (dBm), LO Power (dBm)=14, Device=R10C7 im3 avg (dBm), LO Power (dBm)=14, Device=R11C7 -40 im3 avg (dBm), LO Power (dBm)=13, Device=R14C8 im3 avg (dBm), LO Power (dBm)=14, Device=R10C7 im3 avg (dBm), LO Power (dBm)=14, Device=R11C7 -50 im3 avg (dBm), LO Power (dBm)=14, Device=R12C5 im3 avg (dBm), LO Power (dBm)=14, Device=R12C8 im3 avg (dBm), LO Power (dBm)=14, Device=R12C8_2 im3 avg (dBm), LO Power (dBm)=14, Device=R14C6 -50 im3 avg (dBm), LO Power (dBm)=14, Device=R12C5 im3 avg (dBm), LO Power (dBm)=14, Device=R12C8 im3 avg (dBm), LO Power (dBm)=14, Device=R12C8_2 im3 avg (dBm), LO Power (dBm)=14, Device=R14C6 -60 im3 avg (dBm), LO Power (dBm)=14, Device=R14C8 im3 avg (dBm), LO Power (dBm)=15, Device=R10C7 im3 avg (dBm), LO Power (dBm)=15, Device=R11C7 -60 im3 avg (dBm), LO Power (dBm)=14, Device=R14C8 im3 avg (dBm), LO Power (dBm)=15, Device=R10C7 im3 avg (dBm), LO Power (dBm)=15, Device=R11C7 -70 im3 avg (dBm), LO Power (dBm)=15, Device=R12C5 im3 avg (dBm), LO Power (dBm)=15, Device=R12C8 im3 avg (dBm), LO Power (dBm)=15, Device=R12C8_2 -70 im3 avg (dBm), LO Power (dBm)=15, Device=R12C5 im3 avg (dBm), LO Power (dBm)=15, Device=R12C8 im3 avg (dBm), LO Power (dBm)=15, Device=R12C8_2 -80 15 16 17 18 19 20 21 22 LO freq (GHz) im3 avg (dBm), LO Power (dBm)=15, Device=R14C6 im3 avg (dBm), LO Power (dBm)=15, Device=R14C8 T2 level (dBm) , LO Power (dBm)=12, Device=R10C7 -80 17 18 19 20 21 22 23 24 LO freq (GHz) im3 avg (dBm), LO Power (dBm)=15, Device=R14C6 im3 avg (dBm), LO Power (dBm)=15, Device=R14C8 T2 level (dBm) , LO Power (dBm)=12, Device=R10C7 Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com Page 4 of 7 Characteristic Data and Specifications are subject to change without notice. (c)2007 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws. 32.0-42.0 GHz GaAs MMIC Image Reject Mixer February 2007 - Rev 16-Feb-07 M1003-BD 1.080 (0.043) Mechanical Drawing 1.800 (0.071) 2 3 XM1003-BD 0.900 (0.035) 0.564 (0.022) 1 0.0 0.0 4 1.080 (0.043) 1.500 (0.059) (Note: Engineering designator is 38IRM0363) Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad. Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold All Bond Pads are 0.100 x 0.100 (0.004 x 0.004). Bond pad centers are approximately 0.109 (0.004) from the edge of the chip. Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.674 mg. Bond Pad #1 (RF) Bond Pad #3 (LO) Bond Pad #2 (IF1) Bond Pad #4 (IF2) RF Arrangement IF1 2 3 XM1003-BD LO RF 1 4 IF2 Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com Page 5 of 7 Characteristic Data and Specifications are subject to change without notice. (c)2007 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws. 32.0-42.0 GHz GaAs MMIC Image Reject Mixer February 2007 - Rev 16-Feb-07 M1003-BD App Note [1] USB/LSB Selection - LSB USB For Upper Side Band operation (USB): With IF1 and IF2 connected to the direct port (0) and coupled port (90) respectively as shown in the diagram, the USB signal will reside on the isolated port. The input port must be loaded with 50 ohms. For Lower Side Band operation (LSB): With IF1 and IF2 connected to the direct port (0) and coupled port (90) respectively as shown in the diagram, the LSB signal will reside on the input port. The isolated port must be loaded with 50 ohms. IF2 IF1 An alternate method of Selection of USB or LSB: USB LSB In Phase Combiner In Phase Combiner -90 o -90o IF2 IF1 IF2 IF1 Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com Page 6 of 7 Characteristic Data and Specifications are subject to change without notice. (c)2007 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws. 32.0-42.0 GHz GaAs MMIC Image Reject Mixer February 2007 - Rev 16-Feb-07 M1003-BD Handling and Assembly Information CAUTION! - Mimix Broadband MMIC Products contain gallium arsenide (GaAs) which can be hazardous to the human body and the environment. For safety, observe the following procedures: * Do not ingest. * Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical processing as these by-products are dangerous to the human body if inhaled, ingested, or swallowed. * Observe government laws and company regulations when discarding this product. This product must be discarded in accordance with methods specified by applicable hazardous waste procedures. Life Support Policy - Mimix Broadband's products are not authorized for use as critical components in life support devices or systems without the express written approval of the President and General Counsel of Mimix Broadband. As used herein: (1) Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. (2) A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. ESD - Gallium Arsenide (GaAs) devices are susceptible to electrostatic and mechanical damage. Die are supplied in antistatic containers, which should be opened in cleanroom conditions at an appropriately grounded anti-static workstation. Devices need careful handling using correctly designed collets, vacuum pickups or, with care, sharp tweezers. Die Attachment - GaAs Products from Mimix Broadband are 0.100 mm (0.004") thick and have vias through to the backside to enable grounding to the circuit. Microstrip substrates should be brought as close to the die as possible. The mounting surface should be clean and flat. If using conductive epoxy, recommended epoxies are Tanaka TS3332LD, Die Mat DM6030HK or DM6030HK-Pt cured in a nitrogen atmosphere per manufacturer's cure schedule. Apply epoxy sparingly to avoid getting any on to the top surface of the die. An epoxy fillet should be visible around the total die periphery. For additional information please see the Mimix "Epoxy Specifications for Bare Die" application note. If eutectic mounting is preferred, then a fluxless gold-tin (AuSn) preform, approximately 0.0012 thick, placed between the die and the attachment surface should be used. A die bonder that utilizes a heated collet and provides scrubbing action to ensure total wetting to prevent void formation in a nitrogen atmosphere is recommended. The gold-tin eutectic (80% Au 20% Sn) has a melting point of approximately 280 C (Note: Gold Germanium should be avoided). The work station temperature should be 310 C +/- 10 C. Exposure to these extreme temperatures should be kept to minimum. The collet should be heated, and the die pre-heated to avoid excessive thermal shock. Avoidance of air bridges and force impact are critical during placement. Wire Bonding - Windows in the surface passivation above the bond pads are provided to allow wire bonding to the die's gold bond pads. The recommended wire bonding procedure uses 0.076 mm x 0.013 mm (0.003" x 0.0005") 99.99% pure gold ribbon with 0.5-2% elongation to minimize RF port bond inductance. Gold 0.025 mm (0.001") diameter wedge or ball bonds are acceptable for DC Bias connections. Aluminum wire should be avoided. Thermo-compression bonding is recommended though thermosonic bonding may be used providing the ultrasonic content of the bond is minimized. Bond force, time and ultrasonics are all critical parameters. Bonds should be made from the bond pads on the die to the package or substrate. All bonds should be as short as possible. RoHS Compliant Parts - All Mimix products are RoHS compliant unless specifically ordered with Tin-Lead finish. Ordering Information Part Number for Ordering XM1003-BD-000V XM1003-BD-EV1 Description "V" - vacuum release gel paks XM1003-BD die evaluation module Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com Page 7 of 7 Characteristic Data and Specifications are subject to change without notice. (c)2007 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept their obligation to be compliant with U.S. Export Laws. |
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